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New solvent free laminating adhesives for metalised multilayer packaging

Packaging Solutions

Toyo-Morton has developed the new Ecoad series of polyurethane solvent free laminating adhesive systems for the food packaging and industrial markets. Ecoad adhesive systems are compatible with continuous lamination of metalised packaging structures with two or three layers, while exhibiting a smooth appearance with no degradation to metalized films – a feat that had been difficult to accomplish. In addition, these solvent free adhesives contain no VOC, offering increased sustainability to end users.

‘While solvent free adhesives are popular in Europe and the Americas, they represent only five to 10% of all laminating adhesives used in Japan,’ explained Yusei Uchiyama, engineering team leader of Toyo-Morton. ‘In general, solvent free systems are not considered suitable for the continuous processing of multilayer films, as they tend to form bubbles or warp in the laminates. Addressing the bubble problem, Toyo-Morton engineers worked to establish a new methodology for adhesive layer rheology analysis that enabled them to identify the factors that cause tunnelling in metallised laminates. These findings led to the development of adhesives with enhanced physical properties, like the high heat and chemical resistance and laminate durability needed to bring about optimal adhesion without impacting the packaging material.’ Furthermore, Ecoad solvent free systems do not need to be diluted with an organic solvent before laminating bringing significant environmental advantage to end users.


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