Sun Chemical introduces solvent free ULM adhesive for sustainable flexible packaging

Packaging Solutions

Sun Chemical has announced the launch of a new SunLam solvent free ultra low monomer (ULM) adhesive, designed for packaging producers in search of high performance applications that offer a sustainable alternative to existing solvent based adhesives.

Officially titled SunLam QA-8000+HA450, the new adhesive is part of the company’s proprietary ULM technology. The adhesive extends its capabilities to meet the needs of flexible packaging manufacturers producing high end applications such as extended boiling pasteurisation, hot filling, low retort packaging and products that require improved chemical resistance in acidic or alcoholic environments.

Engineered for high performance applications, the new product:

• Helps reduce energy consumption and CO2 emissions: its VOC free formulation has no drying requirements on a laminator.

• Supports lightweighting and facilitates mechanical recyclability for mono-material packaging thanks to a lower coating weight compared to solvent based technology.

• Offers easy processability and fast bond strength development.

• Features excellent thermal resistance and lay down on printed substrates.

SunLam QA-8000+HA450 has been fully tested in combination with Sun Chemical’s full polyurethane (PU) solvent based inks technology and also works seamlessly with Aqualam water based inks to ensure compatibility for retort applications.

Nicolas Bétin, director of product strategy EMEA, packaging inks and materials, commented: ‘We are delighted to launch SunLam QA-8000+HA450, which offers packaging producers an energy efficient alternative that delivers the performance required for high end packaging. This product underscores our commitment to providing customers with a portfolio that balances efficiency and safety with sustainability demands.  At Sun Chemical, we are proud to offer a range of full PU and non solvent technologies for adhesive and ink solutions.’